Sputter deposition is a commonly used term in materials science and is pronounced /ˈspʌtər dɛpəˈzɪʃən/. The word "sputter" is derived from the sound made when a material is bombarded with high-energy particles, causing atoms to be ejected from the surface. In sputter deposition, a target material is bombarded with ions or atoms, causing atoms to be ejected and deposited onto a substrate. The term "deposition" simply refers to the act of depositing or laying down a thin film of material.
Sputter deposition is a method of thin film deposition that involves the ejection and deposition of atoms or molecules from a solid target onto a substrate through the use of high-energy ions or atoms. This technique is commonly used in various fields of science and engineering, particularly in the fabrication of electronic devices, optical coatings, and thin film research.
In sputter deposition, a vacuum chamber is used to house the target material, which is typically a solid metal or compound. High-energy particles, such as ions or atoms, are accelerated towards the target surface through the application of an electric field or plasma. When these high-energy particles collide with the target material, they cause the ejection of atoms or molecules from its surface.
The ejected particles, known as sputtered atoms or target ions, then travel through the vacuum chamber and deposit onto a substrate located in close proximity to the target. This substrate could be a wafer, glass, or any other material that requires a thin film coating.
The sputter deposition process offers several advantages over other deposition techniques. It provides excellent control over the film thickness and composition, allowing for precise film engineering. Additionally, it enables the deposition of a wide range of materials, including metals, ceramics, and polymers. The resulting film exhibits good adhesion, uniformity, and conformality, making it suitable for a variety of applications in industries such as electronics, optics, and surface engineering.
The word "sputter deposition" is derived from the process of sputtering and the act of deposition.
The term "sputter" originated from the verb "to sputter", which means to make explosive or popping sounds. This verb is believed to have emerged from Old Norse "sputra", meaning to spit. In the context of vacuum-based thin film deposition, sputtering refers to the process in which atoms are ejected from a target material due to bombarding it with high-energy ions or energetic particles. This phenomenon produces a sputtering sound in the process.
The term "deposition" comes from the Latin word "deponere", which means "to put or place down". In the context of materials science, deposition refers to the process of applying or depositing a thin film or layer of material onto a substrate through various techniques.